SEGi University’s Collaboration with ORSTECH Sets New Standards in Engineering Excellence

SEGi University further solidified its position as a leader in engineering education through a momentous MoA Signing Ceremony with ORS Technologies (ORSTECH) on 5 March 2024. With 40 esteemed attendees gathered, the event heralded a new era of collaboration aimed at advancing engineering technology and education. 

Its Vice Chancellor, Professor ChM Dr Sharon Teh Geok Bee FaSc, in her address, highlighted ORSTECH’s significant contributions to the engineering simulation field since its inception in 2007. She emphasised the transformative role of simulation in providing students with practical learning experiences, underscoring SEGi’s commitment to innovation and education. 

Representing ORSTECH, Shahrul elucidated the wealth of facilities and resources available to support students, emphasising the value of professional certification and internships in enhancing their skills and employability. This collaboration reaffirms SEGi’s dedication to nurturing the next generation of engineers in a collaborative and innovative environment. 

The unveiling of the collaborative project, “Performance of Brazed 3D Printed Nanostructured Copper Open Cell Foam Heat Exchanger,” exemplifies the synergy between industry and academia in tackling real-world engineering challenges. This partnership underscores SEGi’s academic excellence and highlights its commitment to practical, hands-on learning experiences. 

The MoA signing ceremony begins a promising partnership to advance engineering knowledge, technology, and education. As SEGi looks ahead to future collaborative efforts, it remains committed to shaping the future of engineering excellence.